Deferment during a medical or dental internship or residency program

Section 455(f) of the Higher Education Act of 1965 (20 U.S.C. 1087e(f)) is amended— (1) in paragraph (1), in the matter preceding subparagraph (A), by striking A borrower and inserting Except as provided in paragraph (7), a borrower; (2) in paragraph (2)(A)— (A) in clause (i), by striking or after the semicolon; (B) by striking the matter following clause (ii); (C) in clause (ii), by striking the comma at the end and inserting; or; and (D) by adding at the end the following: (iii) is serving in a medical or dental internship or residency program;; and (3) by adding at the end the following: (7) Special rule for certain in school deferment Notwithstanding any other provision of this Act, a borrower described in paragraph (2)(A)(iii) shall be eligible for a deferment, during which periodic installments of principal need not be paid and interest shall not accrue on any loan made to the borrower under this part..