Funding for fan-out wafer level packaging program of industrial base analysis and sustainment program

(a) Increase Notwithstanding the amounts set forth in the funding tables in division D, the amount authorized to be appropriated in section 201 for research, development, test, and evaluation, Defense-wide, line 233, as specified in the corresponding funding table in section 4201, is hereby increased by $10,000,000 for the fan-out wafer level packaging program of the Industrial Base Analysis and Sustainment Program of the Department of Defense. (b) Offset Notwithstanding the amounts set forth in the funding tables in division D, the amount authorized to be appropriated in section 301 for operation and maintenance Defense-wide, line 480, as specified in the corresponding funding table in section 4301, for the Office of the Secretary of Defense, is hereby reduced by $10,000,000.