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S. 4784IntroducedSenate · nowHousePresidentLawIn committee
Sec. 844 · S. 4784

Amendments to requirements pertaining to printed circuit boards

Division A — Department of Defense authorizations › Title VIII — Acquisition policy, acquisition management, and related matters › Subtitle C — Industrial base matters

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(a) In general Section 4873 of title 10, United States Code, is amended— (1) in subsection (a)(1), by inserting, copper clad laminate, copper foil, or glass after printed circuit board; and (2) in subsection (c)— (A) in paragraph (2), by striking that— and inserting containing copper foil, copper clad laminates, glass, or any other copper-containing inputs that—; and (B) by adding at the end the following new paragraphs: (7) Copper clad laminate The term copper clad laminate means a composite material consisting of copper foil bonded to a dielectric substrate used in the manufacture of printed circuit boards. (8) Copper foil The term copper foil means thin sheets of copper used as a conductive layer in copper clad laminates or printed circuit boards. (9) Glass The term glass means glass fibers used as a dielectric in copper clad laminates or printed circuit boards.. (b) Effective Date The amendments made by subsection (a) shall take effect on January 1, 2029.